Introducing LPCAMM2, the groundbreaking compression-attached memory module poised to redefine the power efficiency and memory configuration landscape in upcoming laptops. Recently standardized by JEDEC, LPCAMM2 encapsulates dual-channel LPDDR5/X and DDR5 memory on a slim, replaceable circuit board. At CES 2024, Micron Technology, a prominent memory chipmaker, revealed its readiness to supply LPCAMM2 modules, offering options in 16GB, 32GB, and 64GB capacities.
LPCAMM2 is set to have a more significant impact on laptops that traditionally employ DDR5 memory, contrasting with those utilizing LPDDR5/X. This distinction arises from LPCAMM2 utilizing LPDDR5/X in a distinct physical configuration. The modules are notably more compact than the DDR5 SODIMMs prevalent in high-powered laptops, with LPDDR5/X showcasing enhanced power efficiency and potential speed, boasting a maximum supported data rate of 9,600Mbps. The “LP” in “LPDDR” designates “low power,” underlining the energy-efficient nature of this memory technology.
An essential breakthrough accompanies LPCAMM2—upgradability. Addressing a limitation of current LPDDR5/X designs that are typically soldered to motherboards, making them inflexible and non-upgradable, LPCAMM2 offers a solution. While the modules cannot be removed without tools, the inclusion of three accessible screws facilitates attachment to the connector. The standardized design raises the possibility of purchasing modules from various manufacturers, fostering a more dynamic and user-friendly upgrade experience.
While Micron stands as the first company to announce the availability of LPCAMM2 modules, others are anticipated to follow suit. Samsung, in September 2023, unveiled its own LPCAMM memory, serving as the developmental precursor to the commercialized LPCAMM2. Although production details from Samsung are yet to be disclosed, the industry eagerly anticipates a broader market adoption of this innovative memory technology.
