Dutch chip equipment maker BE Semiconductor Industries (Besi) said it expects a sharp rise in fourth-quarter sales, supported by strong orders for its hybrid bonding tools used in AI and data center applications. The company projects revenue growth of 15–25% compared with the previous quarter, after reporting a 15.3% year-on-year decline to €132.7 million in Q3.
Besi, a key supplier to chipmakers including Nvidia, Broadcom, and TSMC, said third-quarter orders rose 15.1% to €174.7 million, driven by increased bookings from Asian subcontractors for AI and photonics systems. CEO Richard Blickman noted that demand from “leading AI players” is helping offset weakness in mobile and automotive chip markets.
The company also announced a new €60 million share buyback program after completing a €100 million repurchase in October. Gross margins are expected to remain stable between 61% and 63% in Q4, compared with 62.2% in the previous quarter.
Besi’s outlook aligns with broader optimism across the semiconductor industry, as chipmakers ramp up investment in AI-driven infrastructure despite sluggish recovery in traditional markets like PCs and vehicles.
