Samsung Electronics said customers have praised the differentiated competitiveness of its next-generation high-bandwidth memory chips, HBM4, with some even remarking that “Samsung is back,” according to co-CEO and semiconductor chief Jun Young-hyun.
Speaking in a New Year address reviewed by Reuters, Jun said the positive feedback reflects growing confidence in Samsung’s HBM4 technology, while noting that further efforts are still needed to strengthen its competitive edge. The comments come as Samsung seeks to regain momentum in the fast-growing artificial intelligence chip market.
In October, Samsung said it was in “close discussions” to supply HBM4 chips to U.S. AI leader Nvidia. The South Korean chipmaker has been racing to catch up with rivals, particularly domestic competitor SK Hynix, which has taken an early lead in high-bandwidth memory used for AI accelerators.
SK Hynix CEO Kwak Noh-jung said in his own New Year remarks that the company benefited from favourable external conditions as demand for AI chips materialised faster than expected. However, he warned that competition is intensifying rapidly, stressing that AI demand is now a given rather than an upside surprise. Kwak added that the business environment in 2026 would be tougher than last year, underlining the need for bolder and sustained investment to prepare for the future.
According to data from Counterpoint Research, SK Hynix was the leading player in the HBM market in the third quarter of 2025 with a 53% share, followed by Samsung at 35% and Micron at 11%.
Investor optimism was reflected in the stock market. On the first trading day of the year, shares of Samsung Electronics rose 7.2%, while SK Hynix gained 4%, both hitting record highs and outperforming South Korea’s benchmark KOSPI index, which rose 2.3%.
Turning to Samsung’s foundry business, which manufactures chips designed by external customers, Jun said recent supply agreements with major global clients had left the unit “primed for a great leap forward.” In July, Samsung signed a $16.5 billion chip manufacturing deal with Tesla.
In a separate address, Samsung co-CEO TM Roh, who heads the company’s device experience division covering smartphones, TVs and home appliances, warned that 2026 is likely to bring greater uncertainty and risks. Citing rising component prices and global tariff barriers, Roh said Samsung would reinforce its core competitiveness through proactive supply-chain diversification and optimisation of global operations to mitigate sourcing, pricing and tariff-related risks.
